20W 50w Laser Scribing Machine , Fibre Laser Cutting Machine For
Solar Cell
(Model:PE-20W/50W)
※Product Introduction of laser dicing silicon wafer
Perfect Laser produced a new generation of 20w 50W Solar cell fiber cutting machine mainly used for metal and silicon, germanium, gallium arsenide and
other semiconductor material substrate scribing and cutting,
machinable solar panels, silicon, ceramic , aluminum foil, etc.,
Artifacts refinement and blazonry, trimming smooth. Silicon wafer machine adopting continuous pumping acousto-optic adjustable Q’s Nd: YAG
laser as work light source, The two-dimensional work table of dicing wafer is controlled by computer,and could do kinds of movement according
to what graphics be input in.High output power, high precision
scribing, fast speed and could cut curve and straight line graph.
※Product Features of laser dicing silicon wafer
1. Software upgrade: support the arc interpolation,circular arc
cutting more smoothly;
2. 20w 50W Solar cell fiber cutting machine upgrade: covers an area
of space smaller after modification, operating more accord with
human body engineering;
3. Refactoring workbench processing part, open-type workbench
processing area, up-down material more convenient. Removed spare
parts from the workbench tablet, higher precision and not easy to
deformation
4. Improvement the screw parts: screw lead increased, so as to
expedite the processing speed, guarantee machining accuracy;
5. Direct plug-in light path design, higher machining precision,
better effect ;
6. Serve motor modification: run more smoothly, smaller cutting
noise,more humanized design;
7. Authoritarian flat dust removal device, The processing effect is
better;
8.Improved the laser signal control section, software runs more
stable and fast.
※Product Advantage of laser dicing silicon wafer
1.The core parts adopt imported brand;
2.Fiber Laser has stronger adaptability to the environment;
3.Better beam quality(basic modeTEM000),thinner kerf width, more
smooth edges;
4.Higher conversion efficiency, lower running cost, smaller
equipment volume (air cooling);
5.The laser pulse width are more narrow, higher peak power, faster
scribing speed;
6.[Battery Cell automatic adsorption ,don’t need pedal;]
7.For a long time continuous operation without maintenance, no
consumable parts replacement;
8.Software upgrade to version 5.0,parameters of concentrated
control, software configurations save;
9.Touch screen operation, serve motor driving(optional).
※Technical Parameter of laser dicing silicon wafer
| Model specification | PE-20W/50W Laser Scribing Machine |
| Laser wavelength | 1064nm |
| Laser power | 20W |
| Scribing line width | 50um |
| Scribing speed | 240mm/s |
| Scribing precision | ±10um |
| Workbench wide | 200×200mm |
| Temperature control precision | 0.5℃ |
| Working power supply | 220V/50Hhz/1.5KVA |
| Workbench | Cell automatic adsorption, dust removal |
| Cooling way | High precision and constant temperature circulating water cooling
professional integration | Air cooling |
※Application Field and Samples of laser dicing silicon wafer
Solar photovoltaic industry, monocrystalline silicon and
polycrystalline silicon solar battery (cell) and silicon (wafer) of
scribing processing (cutting section).
※Packaging & Delivery
1. Prompt deliver at the very day.
2. Well-trained and disciplined packing team.
3. After-sale service:. Any questions or problems after receiving
the product, please feel free to contact us. Problems would be
solved for you immediately.
4. Sophisticated and professional logistic agent.
※Competitive Advantages
1. 100% custom pass guaranteed.
2. Our products have been exported to Germany, Norway, Poland,
Finland, Spain, UK, France, Russia, USA, Brazil, Mexico, Australia,
Japan, Korea, Thailand, Indonesia, Uruguay and many other
countries.
3. Flexible and Untraceable payment terms.
4. Good after-sale service.
5. We offer high quality products at competitive price in quick
delivery.
20W 50w Laser Scribing Machine , Fiber Laser Cutting Machine For
Solar Cell.pdf
